Aeropex develops high-precision 2D Fiber Array Units that couple optical fibers to two-dimensional photonic devices — the foundational building block for co-packaged optics and the next generation of AI-scale interconnects.
A 2D Fiber Array Unit positions optical fibers in a precise two-dimensional grid — rows and columns of fibers at controlled pitch — so that an entire fiber network aligns, at once, to a two-dimensional photonic device.
Where conventional 1D arrays couple a single row of fibers, a 2D FAU turns the full two-dimensional area of a VCSEL array, photodiode array, grating coupler or co-packaged optical engine into usable interconnect density — the requirement at the heart of AI-scale data networking.
AI clusters are pushing optical interconnect density past what single-row coupling can deliver. Aeropex 2D FAUs address the core requirements directly.
Couple the entire area of a photonic device, not just a single row — multiply channel density without multiplying footprint.
V-groove pitch controlled to sub-micron tolerances for repeatable, low-loss optical coupling across the full array.
Processes designed for reproducibility and scale — from precision v-groove fabrication through automated assembly and metrology.
Joint-development ready — technical dialogue, sample evaluation and qualification support from first contact to volume.
Phase-one products are engineered around 125 µm fiber on 250 µm pitch, with fine-pitch and custom variants for emerging requirements.
The workhorse 2D array — 125 µm fiber on a 250 µm grid, balancing density with manufacturability and yield.
Maximum-density 2D array with adjacent-fiber 125 µm pitch, for the highest channel counts per unit area.
Application-specific geometry, channel layout, materials and end-face finish — co-developed with your team.
From the co-packaged optical engine to the optical backplane, two-dimensional fiber coupling is becoming a load-bearing technology.
Dense coupling to VCSEL and photodiode arrays in CPO modules for AI accelerators and switch silicon.
High-fanout optical links for 800G / 1.6T interconnects across compute and fabric.
Board- and system-level optical routing where dense 2D fiber terminations are required.
Beyond the core 2D FAU platform, Aeropex is developing detachable and expanded-beam array technologies for the next wave of optical interconnect.
A re-mateable 2D fiber interface with repeatable sub-micron re-alignment — built for serviceability, testability and field reconfiguration.
Expanded beamA micro-lens-integrated array that expands the beam at the interface — relaxing alignment tolerance and resisting contamination.
Aeropex is building FAU capability along the full path from sub-micron v-groove fabrication through automated assembly and qualification — with a North American manufacturing focus and a roadmap toward stable volume supply.