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Development progress & roadmap

A transparent view of where Aeropex stands on the path from sub-micron precision capability to volume manufacturing — and the challenges we are working through.

Roadmap

From precision process to volume readiness

The phase-one focus: consolidate FAU development and manufacturing capability, with a North American market foundation.

1 · Precision process

Sub-micron v-groove fabrication and fiber placement, with metrology to prove channel-to-channel uniformity.

2 · Pilot capability

Automated assembly and end-face finishing at pilot scale, with reliability and environmental screening.

3 · Volume readiness

Yield-optimised processes and qualification support for joint-development partners moving to volume.

Updates

Public development updates

Select, shareable milestones. Detailed test data and process specifics are provided under NDA.

Phase 1 · Now

Standard 2D FAU platform established

125 µm fiber on 250 µm pitch, with v-groove pitch accuracy in the ±0.5 µm class across 2D layouts up to 16×16.

In progress

Fine-pitch (125 µm) process maturation

Bringing adjacent-fiber pitch to manufacturable yield — the density frontier for the most space-constrained interfaces.

In progress

Automated placement & end-face finishing

Scaling assembly beyond manual precision toward repeatable, high-volume production.

Planned

Reliability & environmental qualification

Temperature cycling, mechanical stress and lifetime screening to support customer qualification programs.

Planned

Joint-development & sample programs

Opening sample evaluation and co-development with strategic partners in AI networking and optical interconnect.

Advanced branch · In exploration

DFAU — Detachable FAU

A re-mateable 2D fiber array interface — repeatable sub-micron re-alignment, serviceability and field reconfiguration.

Advanced branch · In exploration

EBO 2D FAU — Expanded Beam Optical

Micro-lens-integrated expanded-beam coupling that relaxes alignment tolerance and resists contamination.

Technical Focus

Challenges & directions

The hard problems that define the next phase of FAU development.

Uniformity across the full array

Every added channel raises the bar on placement, bonding and polish consistency. Our focus is making uniformity hold at scale, not just at single-digit channel counts.

Yield at fine pitch

At 125 µm pitch, tolerances compound and defects propagate. Process control — not heroics — is what makes density economical.

Metrology you can trust

Sub-micron capability is only as good as the measurement behind it. We invest in inline optical metrology for pitch, position and finish.

Material & thermal stability

Alignment must survive temperature and lifetime. We engineer substrate, adhesive and fiber choices for thermo-mechanical stability.